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SkyCross partners with Infineon on mobile phone architecture (News wire)
SkyCross, a global antenna solutions company, has partnered with Infineon Technologies to reduce the bill of materials for ultra-low cost handsets. The handset architecture leverages the technical advantages of Infineon chips and SkyCross iMAT antennas to eliminate conventional
Infineon signs agreement with Motorola to develop 3G radio frequency chip (News wire)
Infineon Technologies has announced that it has signed an agreement with Motorola to develop a new multi-mode, single-chip 3G radio frequency (RF) transceiver based on Infineon's SMARTi UE chip.
Infineon multimedia platform selected by LGE for new EDGE mobile phones (News wire)
Infineon Technologies has announced that LG Electronics has chosen Infineon as phone platform supplier for its new EDGE (Enhanced Data Rates for GSM Evolution) mobile handsets.
OMTP Group Announces New Participants (News wire)
Mobile telecommunications group receives further support as more industry players join
OMTP Limited has announced that it has increased the number of members and participants to 40 with the addition of the following companies:
TJAT Provides Messaging Solutions to World’s Lowest Cost Smart Phone for Third World Countries at Mobile World Congress (News wire)
Tjat, specialist in seamless mobile messaging solutions, is showcasing its new messaging services on the new ‘Ultra Low Cost Smart Phone' at MWC.
TTPCom collaborates on EDGE interface standard (News wire)
Enables greater silicon choice for handset manufacturers
TTPCom, the world’s leading independent supplier of digital
wireless technology, today announces its involvement
in the creation and development of the DigRF interface
standard for EDGE, Classes 1 to 12.