Chipsets

QUALCOMM and Openwave Announce Agreement to Drive Global Advancement of 3G WCDMA (UMTS) Handsets

Solution Enables Faster Time to Market for Feature-Rich Devices

3GSM World Congress
QUALCOMM Incorporated, pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, and Openwave Systems Inc, the leading provider of open software products

Alcatel and QUALCOMM initiate interoperability testing for HSDPA

3GSM World Congress
Alcatel has today announced that it is initiating interoperability tests between its Alcatel Evolium multi-standard mobile network infrastructure solution and QUALCOMM's HSDPA (High-Speed Downlink Packet Access)-enabled MSM6275 chipset.

QUALCOMM Announces Tri-Band RF Solution to Deliver Global WCDMA Roaming

Travel the World With a Single WCDMA Device

3GSM World Congress

QUALCOMM has today announced a tri-band WCDMA (UMTS)/HSDPA and quad-band GSM/GPRS/EDGE (EGPRS) radioOne solution to enable true global roaming between WCDMA markets in Europe, North America and Asia.

Toshiba

Universal Array platform shortens SoC turn-around times while partial frequency/voltage regulator technology reduces IC power consumption

Toshiba Corporation has announced two new system-on-chip (SoC) design platforms that address the critical design challenges facing developers of new and emerging

M-Systems launches DiskOnChip G4

Mobile memory solution

Building on the success of DiskOnChip G3, DiskOnChip G4 provides performance and cost improvements at a capacity that caters to mainstream multimedia-rich handsets

CPS Matrix technology integrated in TTPCom modules

Location system vendor CPS has found one home for its network based location technology called Matrix.

SyChip announces WLAN module for the mobile handheld market

Integrated Passive Device (IPD) technology for the mobile
handheld market

SyChip, the leader in Radio Frequency Chip Scale Modules/System in Package (CSM/SIP) modules, has announced its Integrated Passive Device (IPD) technology as a means for developing miniature products for

Intel collaborates with Nokia and Symbian to help deliver Series 60 Platform-based 3G smartphones

Intel Corporation, Nokia Corporation and Symbian announced today a collaboration to bring smartphones based on the Nokia Series 60 Platform to market using Intel technology, as part of Intel's recent membership in the Nokia Series 60 Product Creation