Chipsets

Handset Manufacturers Choose Texas Instruments and Symbian OS-Based Technologies for 2.5G and 3G Mobile Phones

TI Wireless Technology Powers 28 of 31 Symbian OS-based
2.5G and 3G Handsets

Symbian Ltd and Texas Instruments Incorporated (TI)  today announced that TI wireless technology, including OMAP processors, powers 28 of 31 Symbian OS-based 2.5G and

ARM announces Next-Generation Mobile Multimedia Acceleration

New media and signal processing technology will be implemented in next-generation ARM processors

ARM today launched its new NEON technology, a media and signal processing solution designed to accelerate abroad range of applications. The ARM(R) NEON technology is

Sun Microsystems and ARM to Deliver Pre-Integrated Java Solutions for Mobile Devices

Long-term Collaboration To Integrate Mobile Java Solutions Will Enhance Performance and Reduce Resource Requirements and Cost of Deployment

Sun Microsystems today announced a long-term collaboration to integrate and distribute optimised Java solutions for mobile devices. The integration of

Samsung develops 2.5Gb multi-chip for 3G phones

Samsung Electronics, announced today that it has developed a 2.5Gigabit (Gb) four-die multi-chip package (MCP) designed for use in third generation mobile phones. Samsung's newest MCP, with 2Gbs of NAND Flash and 512Mbs of mobile DRAM, is the

Flash memory for mobile gaming device

Tiger Telematics' eagerly anticipated handheld multi-entertainment device, the Gizmondo, will come complete with the industry's most advanced on-board non-volatile memory chip, mDiskOnChip G3 from M-Systems

Antenova increases its global partnership with an agreement signed with Maruwa for an integrated antenna chipset solution

Antenova signs a research partnership with Maruwa to create a
consolidated RF module with a fully integrated antenna

The innovative antenna company Antenova moves in to the realms of RF modules with a new co-operative research agreement with Maruwa,

Increased memory on a small package

M-Systems meets demand for reliable, ultra high-performance on-board memory within the industry's smallest package

M-Systems is meeting the demand for increased memory performance for mobile and embedded products with DiskOnChip P3, the world's smallest 32-megabyte flash disk.

Antenova and Maruwa hatch joint plan for integrated antenna module

Antenova signs a research partnership with Maruwa to create a
consolidated RF module with a fully integrated antenna

The innovative antenna company Antenova moves in to the realms of RF modules with a new co-operative research agreement with Maruwa,