HomeNewsTTPCom collaborates on EDGE interface standard

    TTPCom collaborates on EDGE interface standard


    Enables greater silicon choice for handset manufacturers

    TTPCom, the world’s leading independent supplier of digital
    wireless technology, today announces its involvement
    in the creation and development of the DigRF interface
    standard for EDGE, Classes 1 to 12.

    The DigRF standard defines a physical interface
    between the baseband and radio ICs (Integrated
    Circuits) within cellular terminals, enabling any
    combination of supporting chipsets.

    This new standard will increase competition in the
    market by enabling handset manufactures to select the
    most appropriate GSM, GPRS or EDGE baseband and radio
    combination, whether that is based on cost or advanced
    features, without undertaking significant integration

    Andrew Fogg, Senior Research and Development Engineer
    at TTPCom and Chairman of the Digital Interface
    Working Group comments, “The DigRF standard gives
    terminal designers a wider choice of chipset
    combinations by ensuring compatibility between
    baseband and RF ICs.  The standard intentionally
    confines itself to the interface between the chips and
    so places very few constraints on the internal design
    of the ICs, leaving manufacturers free to innovate and
    define efficient solutions.”

    TTPCom is heavily involved in the Digital Interface
    Working Group alongside other industry leaders
    including Agere Systems, Infineon Technologies,
    Motorola, Philips, Renesas, RF Micro-Devices, Silicon
    Laboratories, Sony Semiconductors and Devices Europe
    and Skyworks.

    Version 1.12 of the DigRF standard covers GSM, GPRS
    and EDGE and is available for download from The Digital Interface Working
    Group has started work on the 3G version of the
    Interface Standard, which will be released in Spring

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