Qualcomm has partnered with Amazon on a new, multi-generation project aimed at developing technology for AI data centres.
Under the partnership, the technology giants will work together on customised chips for large-scale AI systems, with a focus on AI inference.
They will also develop optical connectivity technology capable of supporting speeds of up to 1.6T, along with future versions of the technology.
Additionally, Amazon will bring its AWS infrastructure and AI capabilities to the project, while Qualcomm will contribute its experience in chip design, processing and system integration.
The companies will also work on optical connectivity designed to move data more quickly around AI data centres, tapping Qualcomm’s SerDes and optical DSP technologies.
Qualcomm also plans to make greater use of AWS AI infrastructure for its own electronic design automation (EDA) work, which includes Amazon Bedrock.
Qualcomm President and CEO, Cristiano Amon, said: “As AI demand accelerates, data centre infrastructure will require advances in both computing and connectivity to deliver greater performance with more efficiency.
“Qualcomm is pleased to work with AWS on customised silicon and connectivity solutions, bringing decades of leadership in advanced processing and power-efficient compute, to deliver breakthrough performance and enable the next generation of AI infrastructure.”
AWS VP, Prasad Kalyanaraman, added: “This collaboration with Qualcomm Technologies builds on a strong foundation of partnership and reflects our shared commitment to pushing the boundaries of what’s possible.
“By working together on customised silicon and advanced connectivity, we’re delivering more performant, efficient, and cost-effective infrastructure for our customers.”
IN RELATED NEWS
