Qualcomm is to start embedding NFC and secure element solutions from NXP Semiconductors into its Snapdragon products.
The chipmaker’s Snapdragon 800, 600, 400 and 200 processor based platforms will now feature NXP’s two contactless technologies, as consumer devices look beyond the traditional mobile payments to home automation, automotive, smart appliances and wearables.
The new Qualcomm platforms will feature NXP’s NQ220 module, which is claimed will speed up the delivery of applications by making the means of sending credentials to devices much quicker. NXP said this module helps reduce design costs and speeds up the implementation of mobile wallets, and transit and access control applications.
Dr. Cormac Conroy, vice president, Qualcomm Technologies, said: “NXP’s NFC and eSE chipsets are a natural addition to Qualcomm Technologies’ platforms, given NXP’s expertise in enabling secure transactions. Qualcomm Technologies is committed to offering the industry’s leading silicon technology that not only fuels today’s latest devices but also drives and enables innovative new applications and form factors in the future.”
Rafael Sotomayor, senior vice president, NXP Semiconductors, added: “We continue to see the market use and acceptance of NFC grow daily, with new applications being created at an astounding rate. Collaborating with Qualcomm Technologies to provide full eSE and NFC functionality on its industry-leading platforms will further expand this growth potential.”
According to figures released by the SIMalliance last month, demand for NFC technology is increasing. In 2014, shipments to Europe increased by 86 percent to 26 million, a growth rate that outpaced the rest of the world.